Rao Tummala - Pettit Chair Professor and Director of Packaging
Research Center
Dr. Rao R. Tummala received the B.S. degree in Physics, Mathematics and
Chemistry from Loyola College, India, the B.E. degree in
Metallurgical Engineering from the Indian Institute of Science, Banglore,
India, the M.S. degree in Metallurgical Engineering from Queen's University
in, and the Ph.D. degree in Materials Science and Engineering from the
University of Illinois. He joined the faculty at Georgia Tech in
1993 as a Pettit Chair Professor in Electronics Packaging and as Georgia State
Research Scholar. He is also the Director of the Low-Cost Electronic
Packaging Research Center funded by NSF as one of its Engineering
Research Centers, the state of Georgia, and US electronics
industry. Prior to joining Georgia Tech, he was an IBM Fellow at the IBM
Corporation, where he invented a number of major technologies for IBM's
products for displaying, printing, magnetic storage and multichip packaging.
He is both a fellow of IEEE and the American Ceramic Society, a member of
the National Academy of Engineering, 1996 General Chair of IEEE-ECTC, 1996
President of ISHM. He was recently named by Industry Week as one of the 50
Stars in the US, for improving US competitiveness.
He is co-editor of widely-used Microelectronics
Packaging Handbook. He published 90 technical papersand holds 21 U.S.
patents and fourty four other inventions. He received a number of
awards including: David Sarnoff award, and substained technical
acheivement award from IEEE, John wagnon's award from ISHM, Materials
Engineering acheivements award from ASM-I, distinguished alumni award from
Univiersity of Illinois, and Arthur Friedberg Memorial award from American
Ceramic Society.
Dr. Tummala's current research interests include packaging materials
(metals, ceramics, and polymers) and processes, mechanical properties of
materials, thin and thick MCMs, thermal and electrical designs, and
integrated passive components.
