Publications

  1. 2010
  2. 2009
  3. 2007
  4. 2005

  1. 2010

    Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, and Sung Kyu Lim. Design and Analysis of 3D-MAPS: A Many-Core 3D Processor with Stacked Memory. To appear in the IEEE Custom Integrated Circuits Conference (CICC), San Jose, California, September, 2010.

    Dong Hyuk Woo, Nak Hee Seong, Dean L. Lewis, and Hsien-Hsin S. Lee. An Optimized 3D-Stacked Memory Architecture by Exploiting Excessive, High-Density TSV Bandwidth. In the 16th International Symposium on High-Performance Computer Architecture (HPCA) Bangalore, India, January, 2010.

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  2. 2009

    Xin Zhao, Dean Lewis, Hsien-Hsin S. Lee, and Sung Kyu Lim. Pre-bond Testable Low-Power Clock Tree Design for 3D Stacked ICs. In IEEE International Conference on Computer-Aided Design (ICCAD), San Jose, CA, November, 2009.

    Dean L. Lewis and Hsien-Hsin S. Lee. Architectural Evaluation of 3D Stacked RRAM Caches. In IEEE International 3D System Integration Conference (3DIC), San Francisco, CA, September, 2009.

    Dean L. Lewis and Hsien-Hsin S. Lee. Testing Circuit-Partitioned 3D IC Designs. In IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Tampa, FL, May, 2009. [pdf] [odp,pdf] [Cite - BibTeX,doc]

    Dean L. Lewis, Sudhakar Yalamanchili, and Hsien-Hsin S. Lee. High Performance Non-blocking Switch Design in 3D Die-Stacking Technology. In IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Tampa, FL, May, 2009. [pdf] [odp,pdf] [Cite - BibTeX, doc]

    Dean L. Lewis and Hsien-Hsin S. Lee. Test Strategies for 3D Die-Stacked Integrated Circuits. In Workshop on 3D Integration - Technology, Architecture, Design, Automation, and Test at the Design, Automation, and Test in Europe Conference (DATE), Nice, France, April, 2009.
        -- Invited for submission

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  3. 2007

    Dean L. Lewis and Hsien-Hsin S. Lee. A Scan-Island Based Design Enabling Pre-bond Testability in Die-Stacked Microprocessors. In Proceedings of the IEEE International Test Conference 2007 (ITC), Santa Clara, CA, October, 2007. [pdf] [ppt] [Cite - BibTeX, doc]
        -- Invited for presentation at Intel

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  4. 2005

    Dean Lewis, Jeff McBride, Mark Mikkelson, and Hoan Nguyen. Design of an Autonomous Unmanned Aerial Reconnaissance Vehicle and Ground Control Station. 3rd Annual Student UAV Competition, Aberdeen, Maryland, July, 2005. [pdf]

    Dean Lewis and Jeff McBride. Innovative Design of a Ground Control Station for the Control of Multiple Unmanned Aerial Vehicles. Student Paper Contest, IEEE Southeastcon 2005, Proceedings, Fort Lauderdale, Florida, April, 2005. [pdf]

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