The School of
Electrical and Computer Engineering
Madhavan Swaminathan - Associate Professor
Dr. Madhavan Swaminathan received the BE degree in Electronics and Communication from Regional Engineering College, Tiruchi, India in 1985 and MSEE and Ph.D degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively. He is currently an Associate Professor in the School of Electrical and Computer Engineering and Research Director for the Systems Prototyping, Design and Test group at the Packaging Research Center, Georgia Institute of Technology, Atlanta, Georgia.
During his graduate study, he was involved in the numerical modeling of waveguides, antennas and transmission lines for microwave applications and their implementation on parallel computers. He was awarded a fellowship by the Northeast Parallel Architecture Center for his work on the solution of large matrix problems on parallel computers.
In 1990, he joined the Advanced Technology Division of the Packaging Laboratory at IBM, E.Fishkill, New York where he was involved with the design, analysis, measurement and characterization of packages for high performance systems and low-cost multilayer thin film technology. He joined the Packaging Research Center in October 1994 to pursue unique challenges arising in low-cost packaging for computer, telecommunication and consumer applications.
Dr. Swaminathan has over 50 publications in refereed journals and conferences, five issued patents and three patents pending. He currently serves as the Co-Chair for the Topical Meeting on Electrical Performance of Electronic Packaging .
He is also the co-founder of the Next Generation IC & Package Design Workshop for which he is the General Chair. This workshop looks into the future issues and challenges associated with the design of high density packages and is currently sponsored by IMAPS and the National Science Foundation.
Dr. Swaminathan's industrial interactions include collaborative research with SUN Microsystems, Cadence Design Systems, Motorola, National Semiconductor, Panda Project, Applied Simulation Labs, Ansoft Corporation, Hughes Research Labs and Sarnoff Corporation.
If you're interested in learning about my research, please visit my High Performance Package Design Lab web page.