Brief Biography:

Muhannad S. Bakir received the B.E.E. degree (summa cum laude) from Auburn University, Auburn, AL, in 1999 and the M.S.E.E. degree from the Georgia Institute of Technology (Georgia Tech), in 2000. He received the Ph.D. degree in electrical and computer engineering from Georgia Tech in 2003.

He is currently a Research Engineer II at the Microelectronics Research Center and Adjunct Professor in the School of Electrical and Computer Engineering at Georgia Tech. His areas of interest include integrated electrical, optical, and fluidic I/O interconnections for 3D gigascale integration and nanofabrication technology. He has published more than 40 refereed and invited publications that appear in conference proceedings and journals. Dr. Bakir has presented a conference tutorial at the 2006 IEEE System-on-a-Chip Conf. (SoCC) and an invited forum presentation at the 2007 IEEE Int. Solid-State Circuits Conf. (ISSCC) where he also participated in a discussion panel on 3D integration.

Dr. Bakir is a recipient of the Georgia Tech President’s Fellowship (1999 to 2003) and the Intel Ph.D Fellowship (2002 to 2003). The awards he received while at Auburn include IEEE’s most outstanding graduating senior from Auburn’s Department of ECE in Spring 1999; and the International Engineering Consortium’s William L. Everitt Student Award of Excellence in 1999. He was also on the Engineering Dean’s Honor List for ten quarters. He has been awarded a MARCO Inventor Recognition Award (2002, 2005) and is the recipient of the Best Invited Paper Award from the 2007 IEEE Custom Integrated Circuits Conference (CICC), the Best Paper Award from the 2002 Electronic Components and Technology Conference (ECTC), the Outstanding Paper Award from the 2007 Electronic Components and Technology Conference (ECTC), and the co-recipient of the Best Student Paper Awards from the 2005 and 2006 IEEE International Interconnect Technology Conference (IITC).

He serves as a committee member for the LEOS Annual Meeting. He is also a member of the International Technology Roadmap for Semiconductors (ITRS) technical working group for Assembly and Packaging (AP).

Professional Activity:

• Committee member, International Technology Roadmap for Semiconductors (ITRS), Assembly and Packaging (AP) Technical Working Group, 2006-present
• Committee member, International Electronics Manufacturing Initiative (iNEMI),Optoelectronics Roadmap Technical Working Group, 2008-present
• Committee member, IEEE LEOS Annual Meeting, 2005-present
• Thrust Leader, New Materials Integration, SRC/DARPA Interconnect Focus Center (IFC) Research Program, 2006-present
• Serve as an NSF proposal reviewer
• Serve on NSF proposal review panels
• Ad hoc reviewer
  • IEEE Photonics Technology Letters
  • IEEE Journal Lightwave Technology
  • IEEE Transactions on Advanced Packaging
  • IEEE Transactions in VLSI
  • IBM J. Research & Development
  • SPIE Optical Engineering
  • ACS Chemical Review
  • and others