Collaboration is vital. That is our belief. To this end, we are always eager for opportunities to exchange ideas, know-how, and technologies with other groups in both industry and academia. Please contact Muhannad Bakir directly.

Our know-how spans a wide range of technologies and interests. Below is a brief and noncomprehensive overview of some of our current research (experimental; modeling not shown) activities:

Through-Silicon Via (TSV)Technology
Electrical and Fluidic microscale I/O
3D Stacking and Bonding
Electrical & Thermofluidic Interconnect Networks in 3D ICs
Microphotonic Waveguides
Silicon Microchannels for 3D ICs
High-Density Flexible Electrical I/O
Heterogeneous IC Integration